Product
NEMST-Jet2008II 系列 NEMST-Jet2008
Atmospheric Plasma Cleaner_RF Jet Type / MW Jet Type
- RF Jet plasma design.
- Multiple reaction gases can be used
- Excellent cleaning effect with concentrated plasma energy.
- Fast treatment speed.
- Gap between nozzle and substrate can be larger.
- Can be standalone machine or module intregrated with in-line mechanism.
- Indirect/Remote plasma design.
- Can be suitable for different kinds of materials with various shapes.
- Reaction gas: Ar, Ar+O2, and etc.
- Low reaction gas consumption and running cost.
- Effective Range: Φ 10 mm or smaller.
- Treatment Speed: 10 mm/sec~300 mm/sec.
- Gap between nozzle and substrate: 5 mm ~ 15 mm.
- Plasma On Stabilizing Time: < 0.5 sec.
- High plasma stability.
- Indirect/Remote Plasma with no ESD.
- Can be suitable for different kinds of materials with various shapes.
- ITO Lead/Finger Cleaning before COG or COF in LCM applications.
- Wafer Photoresist Removal Applications.
- Surface Cleaning or Surface Modification for Electronics or Non-electronics Devices/Materials.
- Surface Treament before Lamination or Plating Processes.
- Suitable for Front-end and Back-end Processes in LCD or Touch Panel Applications.
- Film Growth Applications.